L280-QSC1F20M001-120°规格书
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版本:2019-05-03

湖北深紫科技有限公司

产品规格书
SPECIFICATIONS

深紫外LED灯珠

L280-QSC1F20M001-120°

270~280nm,[email protected],120°出光角,3737封装

QSC1F20M001-120°

湖北深紫科技有限公司

Hubei DUVTek Co., LTD.

湖北省鄂州市梧桐湖新区凤凰大道9号东湖高新科技创意城B08栋
Building B08, Donghu High-tech Innovation City, No. 9 Fenghuang Avenue, Wutong Lake New District, Ezhou, Hubei, China

  • 产品示意图 Mechanical Specifications and Materials
  • 产品示意图 Mechanical Specifications and Materials
    推荐PCB焊盘 Recommended pad for PCB

    建议PCB焊盘
    Recommended pad for PCB

    • 图纸单位: mm
    • 封装:3737封装,外型尺寸:3.7×3.7×1.5 (L×W×H) [单位:mm]
    • 封装材质:氮化铝陶瓷支架,平面透镜
    • 封装芯片数量:1 pcs
    • 除非另有说明,公差为±0.10 mm
    • Unit: mm
    • LED Package: 3737 packaged, with size 3.7×3.7×1.5 (L×W×H) [Unit : mm]
    • Bracket material:Aluminum nitride ceramic
    • Chip inside:1 pcs
    • Tolerances unless otherwise mentioned are ± 0.10 mm
  • 光电特征参数 Typical Optical-Electrical Characteristics(Ta = 25 ℃)
  • Item Symbol Unit Value
    峰值波长 Peak Wavelength λp nm 270~280
    光功率 Radiant Flux P0 mW 2~4
    波峰半高宽 Full Width at Half Maximum Δλ nm 12
    驱动电流 Forward Current If mA 40
    工作电压 Forward Voltage Vf V 5~7
    出光角 Viewing Half Angle 1/2 deg. 120
    热阻 Thermal Resistance RΘj-b ℃/W 18
    最大工作电流 Max Forward Current Ifmax mA /
    • 这些数值由光谱分析仪和积分球测量系统测量。公差如下:工作电压(Vf):±2%;光功率(P0):±10%;峰值波长(λp):±3.0 nm
    • 虽?#20976;?#26377;的LED都是由我们的设备进行测试,但根据测试设备的条件,某些值可能会略有不同。
    • These values measured by Optical spectrum analyzer and integrating sphere measuring system. And tolerances are followings as below: Forward Voltage (Vf): ±2%, Radiant Flux (P0): ±10%, Peak Wavelength (λp): ±3.0 nm
    • Although all LEDs are tested by our equipment, some values may vary slightly depending on the conditions of the test equipment.
  • 光电参数图例 Electro-Optical Characteristics
  • Card image cap
    Relative Intensity vs Peak Wavelength
    (If = 40 mA, Ta = 25 ℃)
    Card image cap
    Radiation Pattern
    (If = 40 mA, Ta = 25 ℃)
    Card image cap
    Normalized Light Output Power vs Ambient Temperature (If = 40 mA)
    无散热条件下测试,实际使用环境应低于50℃
    Card image cap
    Forward Current vs Forward Voltage (Ta = 25 ℃)
    由于芯片特性不同,以上数据仅供参考
    Card image cap
    Normalized Light Output Power vs Current (Ta = 25 ℃)
    驱动电流与归一化光功率的关系
  • 回流焊接 Reflow soldering profile
    • 回流焊接是在电路板上组装LED的推荐方法。 DUVTek不保证通过浸焊方法组装的LED的性能。
    • 推荐的焊接条件(Sn42/Ag1.0/Bi57,SMIC L23-BLT5-T8F)
    • Reflow soldering is the recommended method for assembling LEDs on a circuit board. DUVTek does not guarantee the performance of the LEDs assembled by the dip soldering method.
    • Recommended soldering conditions (Sn42/Ag1.0/Bi57, SMIC L23-BLT5-T8F)
    回流焊接 Reflow soldering profile
  • 防潮封装注意事项 Moisture-Proof Package
    • 在焊接过程中,SMD封装中的湿气可能蒸发并膨胀。
    • 湿气会损坏深紫外LED的光学特性。
    • The moisture in the SMD package may vaporize and expand during soldering.
    • The moisture can damage the optical characteristics of the DUV-LEDs due to the encapsulation.
  • 储存及使用环境条件 Environmental conditions for storage and use
  • Item Symbol Unit Value
    使用温度 Operating Temperature TOPR -30 ~ +60
    存储温度 Storage Temperature TSTG -30 ~ +100
    • 超出上述最大额定值操作,可能会影响器件的可靠性并造成永久性损坏。
    • DUV-LED不可以反向偏压驱动。
    • Operating the DUV-LED beyond the listed maximum ratings may affect device reliability and cause permanent damage. These or any other conditions beyond those indicated under recommended operating conditions are not implied. The exposure to the absolute maximum rated conditions may affect device reliability.
    • The DUV-LEDs are not designed to be driven in reverse bias.
  • 储存条件 During Storage
  • Conditions Temperature Humidity Time
    开封前 Before Opening Aluminum Bag 5~30 ℃ < 50%RH Within 1 Year from the Delivery Date
    开封后 After Opening Aluminum Bag 5~30 ℃ < 60%RH ≤ 672 hours
    烘干 Baking 65±5 ℃ < 10%RH 10~24 hours
  • 使用条件 During Usage
    • LED应避免直接接触有害物质,如硫磺,氯气,邻苯二甲酸盐等。
    • 在操作和储存期间必须避免暴露于腐蚀性气体。
    • 镀银金属部件不仅受到最终产品内部排放的腐蚀性气体的影响,还受到外部环境渗透的气体的影响。
    • 必须避免可能导致冷凝的?#29615;?#29615;境温度变化或高湿度等极端环境。
    • The LED should avoid direct contact with hazardous materials such as sulfur, chlorine, phthalate, etc.
    • The metal parts on the LED can rust when exposed to corrosive gases. Therefore, exposure to corrosive gases must be avoided during operation and storage.
    • The silver-plated metal parts also can be affected not only by the corrosive gases emitted inside of the end-products but by the gases penetrated from outside environment.
    • Extreme environments such as sudden ambient temperature changes or high humidity that can cause condensation must be avoided.
  • 清洗注意事项 Cleaning
    • 请勿使用刷子清洗或用有机溶剂(即丙酮,TCE等)进行清洗,否则可能会损坏LED的树脂。
    • 在以下条件下,异丙醇(IPA)是推荐用于清洁LED的溶剂。
    • 清洁条件:IPA,最高25℃。 ×60秒以内
    • 不建议使用超声波清洁。
    • 预测试应与实?#26159;?#27905;过程一起进行,以验证过程不会损坏LED。
    • Do not use brushes for cleaning or organic solvents (i.e. Acetone, TCE, etc..) for washing as they may damage the resin of the LEDs.
    • Isopropyl Alcohol(IPA) is the recommended solvent for cleaning the LEDs under the following conditions.
    • Cleaning Condition: IPA, 25℃ max. × 60sec max.
    • Ultrasonic cleaning is not recommended.
    • Pretests should be conducted with the actual cleaning process to validate that the process will not damage the LEDs.
  • 热管理条件 Thermal Management
    • 热管理是深紫外LED封装冷却性能中最重要的部分。
    • 即使从开始阶段开始,也必须认真考虑产品的散热设计。
    • 发热量与输入功率之间的协同效率受电路板热阻以及LED布局与其他组件密度的影响。
    • 深紫外LED应焊接在具有高导热性的金属PCB上。或者请将深紫外LED与金属PCB、大容量散热器(Heat Block),一个迷你(空气或水冷却器等组?#26174;?#19968;起使用。
    • 请设计LED模块或系统,使LED封装的温度不超过最大结温(TJ)。
    • The thermal management is the most important thing of the hear dissipation(cooling) performance for the deep UV(UVC) LED Package.
    • The thermal design of the product must be seriously considered even from the beginning stage.
    • The co-efficiency between the heat generation and the input power is affected by the thermal resistance of the circuit boards and the density of the LED placements together with other components.
    • The deep UV(UVC) LED soldered on a metal PCB with a high thermal conductivity. Or Please combine the deep UV(UVC) LED with a metal PCB and a large volume-Heat Sink (Heat Block), a mini(compact / slim)-air or water cooler, etc.
    • Please design the LED module or system in customer that the temperature of the LED Package does not exceed the maximum junction temperature(TJ).
  • 静电放电 Electrostatic Discharge (ESD)
    • LED对静电或浪涌电压和电流敏感。静电放电可能会损坏LED芯片。而且,可以影响LED封装寿命的可靠性。在处理LED时,积极推荐以下ESD措施:1)请佩戴手腕带,防静电?#36335;?#33050;穿和手套。2)请设置接地或防静电的地板漆,接地或能够浪涌保护工作站设备或电源,脉冲发生器,电流/电压驱动电路等工具。3)ESD保护 - 工作台/工作台,由导电材料制成的垫?#21360;?/li>
    • 产品装配中使用的所有设备,设备和机器都需要接地。商业产品的设计时,请在审查后申请浪涌保护。
    • 如果工具或设备包含玻璃或塑?#31995;?#32477;缘材料,强烈建议采取以下措施:1)用导电材料消散静电荷;2)防止水分产生电荷;3)插入离子风机(离子发生器)以中和电荷。
    • 建议?#31361;?#22312;执行时检查LED是否被ESD损坏应用中LED的特性检查。在低电流(≤1.0mA)下正向电压检测(测量)可检测到LED损坏。
    • ESD损坏的LED可能会在低电压下产生电流。*故障标准:在If = 0.5mA时Vf < 4.0V。
    • The LEDs are sensitive to static electricity or surge voltage and current. The Electrostatic Discharge can damage a LED Chip. Also, It can be affect a reliability belong to the life time of LED package. When handling LEDs, the following measures against ESD are actively recommended: 1) Please wear a wrist strap, anti-static clothes, foot wear and gloves. 2) Please set up a grounded or anti-static paint floors, a grounded or the ability to surge protection workstation equipment or power supply, pulse generator, current/voltage driver circuit, etc. and tools. 3) ESD protection- worktable/bench, mat made of conductive materials.
    • An appropriate grounding is required for all devices, equipment, and machinery used in product assembly. Please apply surge protection after review when designing of commercial products.
    • If tools or equipment contain insulating materials such as glass or plastics, the following measures against ESD are strongly recommended: 1) Dissipating static charge with conductive materials; 2) Preventing charge generation with moisture; 3) Plug in the ionizing blowers(ionizer) for neutralizing the charge.
    • The customer is advised to check if the LEDs are damaged by ESD when performing the characteristics inspection of the LEDs in the application. Damage of LED can be detected with a forward voltage checking(measuring) at low current (≤1.0 mA).
    • ESD damaged LEDs may have a current flow at a low voltage. * Failure Criteria: Vf < 4.0V at If= 0.5mA.
  • 人体防护 Human body protection
  • 人体防护 Human body protection
    • UVC倒装芯片发射深紫外线,在其附近具有极高的辐射强度, 这样可以快速消毒,但在此期间必须遵守安全预防措施装配和测试。
    • 通过从制造商处购买UVC LED,?#31361;?#29305;此同意免除制造商因未能遵守本规范中的注意事项造成的任何身体伤害的责任。
    • 所有装配工人,观察员和旁观者必须在进行眼睛?#25512;?#32932;保护。
    • 禁止裸眼观察(包括通过显微镜)和在操作?#26032;?#38706;处理UVC LED。UVC光线很容易被污染物吸收,所以不?#24066;?#35302;摸UVC芯片的蓝宝石侧面。
    • UVC flip chip emits deep ultraviolet radiation, with extremely high intensity near its surface. This allows rapid disinfection but safety precautions must be observed during assembly and testing.
    • By purchasing the UVC LEDs from the manufacturer, the customer hereby agrees to absolve the manufacture's responsibility of any bodily harm as a result of failure to observe the precautions, warnings and guidelines contained within this Specifications.
    • All assembly workers, observers and bystanders must wear eye and skin protection when the UVC LEDs are energized. Bare eye observation (including through microscopes) and bare-hand handling of a UVC LED in operation is PROHIBITED.
    • UVC light can be easily absorbed, so any oil or other absorbent liquid must NOT be allowed to touch the sapphire side of the UVC chip.

    深紫科技,芯片级深紫外LED紫外杀菌技术开拓者

    斯特拉斯堡大学
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